Vapor chamber thermal performance: Partially heated with different heating areas at the center and supported by numerical analysis for the experimental setup

dc.contributor.authorVarol, Yasin
dc.contributor.authorCosanay, Hakan
dc.contributor.authorTamdogan, Enes
dc.contributor.authorParlak, Murat
dc.contributor.authorSenocak, Safak Melih
dc.contributor.authorÖztop, Hakan Fehmi
dc.date.accessioned2026-08-12T18:11:03Z
dc.date.issued2025
dc.departmentFırat Üniversitesi
dc.description.abstractThis paper presents the design of a partially heated Vapor Chamber (VC) system utilizing a passive cooling technique, analyzed under various inclination angles. The Finite Volume Method (FVM) is utilized to compare the results with experimental measurements conducted. Additionally, all results obtained with the tested VC are compared to a copper plate of identical dimensions to demonstrate the VC's impact on thermal management issues. The dimension of the copper VC is established as 56 x 56 mm2. Two distinct partial heating dimensions at the evaporator block, measuring 10 x 10 mm2 and 20 x 20 mm2, are evaluated under various heat flux loads. The study is further expanded to include varying temperatures between the evaporator block and the condenser block. While a chiller controls the temperature on the condenser block side, the power supply to the evaporator block is adjustable to facilitate heating. The inclination angle of the system is identified as an additional parameter for investigation, as it may influence the thermal performance of the vapor chamber due to gravitational effects. At the conclusion of the study, significant results indicated that a higher thermal resistance value was observed for a heating area of 10 x 10 mm2 for both VC and copper plate. The comparison between the copper plate and VC indicates a 7 % reduction in thermal resistance with VC across both selected heating areas. Furthermore, a higher temperature that increases proportionally with heat flux is observed in the case of the copper plate. The effect of inclination appears to be negligible for the parameters examined.
dc.identifier.doi10.1016/j.applthermaleng.2024.124978
dc.identifier.issn1359-4311
dc.identifier.issn1873-5606
dc.identifier.orcid0000-0003-2989-7125
dc.identifier.orcid0000-0003-0602-2836
dc.identifier.orcid0000-0002-5299-2078
dc.identifier.scopus2-s2.0-85209717483
dc.identifier.scopusqualityQ1
dc.identifier.urihttps://doi.org/10.1016/j.applthermaleng.2024.124978
dc.identifier.urihttps://hdl.handle.net/11508/63534
dc.identifier.volume260
dc.identifier.wosWOS:001363490400001
dc.identifier.wosqualityQ1
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherPergamon-Elsevier Science Ltd
dc.relation.ispartofApplied Thermal Engineering
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.snmzKA_WoS_20260511
dc.subjectVapor Chamber
dc.subjectThermal performance
dc.subjectCopper plate
dc.subjectHeat transfer
dc.subjectElectronic cooling
dc.titleVapor chamber thermal performance: Partially heated with different heating areas at the center and supported by numerical analysis for the experimental setup
dc.typeArticle

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