Evaluation of a Pulse-Excited PCB Resolver With Performance and Thermal Analysis

Abstract

This study evaluates the performance of a pulse-excited printed circuit board (PCB) resolver in comparison with the traditional square-wave excitation method. Although the pulse-excited resolver exhibits slightly higher error levels than the square-wave excitation approach, these differences remain acceptable for applications that prioritize reduced power consumption and improved thermal performance. Experimental results indicate that the average position errors of the resolver are 1.109 degrees at low speeds and 0.338 degrees at high speeds. These error levels are considered acceptable for a wide range of industrial applications. Thermal analysis demonstrates that the proposed pulse excitation method substantially reduces thermal stress on the resolver, yielding a maximum temperature of approximately 32.0 degrees C during testing, compared with nearly 59.7 degrees C under square-wave excitation. Overall, the findings highlight the advantages of the proposed method, particularly for applications requiring effective heat management. The results suggest that the pulse-excited resolver represents a viable alternative, combining operational efficiency with enhanced thermal performance.